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Project Background/ Task description:
I require the design and component layout for two PCB through mount circuit boards. The object is to provide a fault reporting mechanism from an existing piece of electrical equipment (SMA power inverter 6000A) to an external device.
The first circuit board (device board) will be a small device mounted within the power inverter, It will pick up a two signals which are sent to a readout diode Lo( 0 ± 0.5V, high (1.8 ± 0.2V) already present on the power inverter board . The board within the inverter to which the device board will be mounted has a floating ground which fluctuates at Australian grid voltage (240 Vac RMS ± 10%). As such, the output from the device board must be isolated from its input signal. An Optocoupler chip (chip marking: 021H58 - SFH6156-3 - V x001) has been used elsewhere on the power inverter to achieve this functionality and I would prefer that it be us...
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